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US Patent Issued to SCREEN HOLDINGS on July 14 for "Substrate cleaning device and substrate cleaning method" (Japanese Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,062, issued on July 14, was assigned to SCREEN HOLDINGS Co. LTD. (Japan). "Substrate cleaning device and substrate cleaning method" was inv... Read More


US Patent Issued to EBARA on July 14 for "Pre-wet module" (Japanese Inventor)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,063, issued on July 14, was assigned to EBARA Corp. (Tokyo). "Pre-wet module" was invented by Mitsutoshi Yahagi (Tokyo). According to the ... Read More


US Patent Issued to Tokyo Electron on July 14 for "Wet processing system and nozzle for dispensing a liquid laterally across a semiconductor wafer" (New York Inventor)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,064, issued on July 14, was assigned to Tokyo Electron Ltd. (Tokyo). "Wet processing system and nozzle for dispensing a liquid laterally ac... Read More


US Patent Issued to Yield Engineering Systems on July 14 for "Unified rinse and dry cleaning apparatus and methods" (Indian Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,065, issued on July 14, was assigned to Yield Engineering Systems Inc. (Fremont, Calif.). "Unified rinse and dry cleaning apparatus and met... Read More


US Patent Issued to Tokyo Electron on July 14 for "Etching control system and etching control method" (Japanese Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,066, issued on July 14, was assigned to Tokyo Electron Ltd. (Tokyo). "Etching control system and etching control method" was invented by To... Read More


US Patent Issued to DISCO on July 14 for "Wafer processing method and wafer processing system" (Japanese Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,067, issued on July 14, was assigned to DISCO Corp. (Tokyo). "Wafer processing method and wafer processing system" was invented by Yuki Ino... Read More


US Patent Issued to Tokyo Electron on July 14 for "Substrate processing method and substrate processing apparatus" (Japanese Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,068, issued on July 14, was assigned to Tokyo Electron Ltd. (Tokyo). "Substrate processing method and substrate processing apparatus" was i... Read More


US Patent Issued to Taiwan Semiconductor Manufacturing on July 14 for "Manufacturing method of the semiconductor package, pick and place device, and workpiece handling apparatus" (Taiwanese Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,069, issued on July 14, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Manufacturing method of the semicon... Read More


US Patent Issued to Sandisk Technologies on July 14 for "Integrated die ejector for die attach ejector devices" (Chinese Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,070, issued on July 14, was assigned to Sandisk Technologies Inc. (Milpitas, Calif.). "Integrated die ejector for die attach ejector device... Read More


US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on July 14 for "Semiconductor wafer processing tool with improved leak check" (Taiwanese Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,071, issued on July 14, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan). "Semiconductor wafer processing ... Read More